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AsiCentrum


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Last Updates:
18.03.2010

SUCCESS STORIES


Examples of our projects that have been solved at the ASICentrum and whose information is allowed to be published represent only a small part of all our design activities, however, they do describe the technical skills, experience and our ability to satisfy all customer's needs.
We are very proud of having the possibility to support our customers with our knowledge and to give them chance to be on the market in due time with their innovative and competitive products.

 

 

EM4298 - RFID UHF Baseband Coprocessor
Project Class digital IC with 51k standard gates
Technical Aspects single chip decoder solution to build RFID UHF reader
Timeframe 2005 - 2006
Development ASICentrum Prague, CADENCE & MENTOR GRAPHICS DESIGN TOOLS
Prototyping development kits with USB interfaces (acc. to pic.1 and 2) are available on request
Production EM4298 ICs in TSSOP28 package are in stock and ready to ship. Information, quotations, orders.

 

EM4026 - 125kHz Read Only Contactless RFID
Project Class Mid complexity mix-mode IC
Technical Aspects 125kHz, anticollision, 64-bit ID number, robust and anti-tampering, passive RFID IC
Timeframe 2004 - 2005
Development Mentor Graphics Tools, Cadence Backend/Frontend, Nassda HSIM Standard cells + full custom design
Prototyping
Production is running, EMDirect Contact Form for ordering and any info

 

EM6580 - Flash µC with 4-bit ADC
Project Class Low complexity mixed-mode IC
Technical Aspects EM6580 is the Flash counterpart of ROM-based EM6680
Timeframe 2003 - 2004
Development Cadence design tools, Mentor Graphics verification Tools, EM Microelectronic Design Kit
Prototyping
Production is running

 

One-dimensional Active Pixel Sensor
Project Class Mixed-mode IC
Technical Aspects Linear optical sensor with control logic and serial communication interface
Timeframe 2002 - 2003
Development Mentor Graphics EDA tools, EM Microelectronic Design Kit
Prototyping nonpublic info
Production nonpublic info

 

ASIC for Capacitive Ceramic Pressure Sensors
Project Class Mixed-mode IC
Technical Aspects capacity/frequency converter
Timeframe 1998 - 1999
Development Mentor Graphics EDA tools, EUROPRACTICE analog models and standard cells libraries
Prototyping an Alcatel Microelectronics 2 µm A/D CMOS technology/EUROPRACTICE MPW run, 10pcs in CSOIC16 package
Production an Alcatel Microelectronics 2 um A/D CMOS technology/EUROPRACTICE run, 28k chips for flip-chip assembly

 

EM6323/24 - µP Supervisory Circuits
Project Class Fully analog IC
Technical Aspects Ultra Low Power, Low Voltage µP Supervisory Circuits with Manual Reset and Watchdog
Timeframe 2001 - 2002
Development Cadence tools, EM Microelectronic Design Kit
Prototyping MPW run, PDIP8 packages
Production ALP1V (1µm CMOS technology) in EM Microelectronic, SOT23-3 and SOT23-5 packages

 

DSP Application for Telecommunication
Project Class DSP digital IC
Technical Aspects RAM+ROM on chip, 22k gates complexity, 18 MHz system frequency
Timeframe 1998 - 2000
Development Mentor Graphics EDA tools, modified ACIIR IP Core used
Prototyping XILINX FPGA XC4028XL in PQFP160 package + serial memory XC1701
Production FPGA to ASIC conversion, ORBIT 0,5µm CMOS gate array technology, PLCC44 package

 

ISDN Terminal Adapter
Project Class Fully digital IC
Technical Aspects 16k gates complexity, 10,7 MHz operating frequency
Timeframe 1999 - 2000
Development Mentor Graphics EDA tools, modified ACDPLL IP Core used
Prototyping XILINX FPGA Spartan XCS40 in PQFP208 package, a simple FPGA board for design provement in real customer’s system operation
Production FPGA to ASIC conversion, ORBIT 0,5µm CMOS gate array technology, PLCC44 and MQFP44 packages

 

 

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